Press Release

NSK to Exhibit for the First Time a Compact, High-Resolution Encoder at INTERMEASURE 2014

Tokyo, Japan, September 17, 2014 - NSK Ltd. (NSK; Headquarters: Tokyo, Japan; President and CEO: Norio Otsuka) today announced that it will exhibit for the first time an encoder in an ultra-compact size (outer diameter of 8 mm) that has achieved a resolution that is among the highest in the world. The product will be unveiled at INTERMEASURE 2014* (International Measurement, Test and Control Technology Show 2014), to be held at Tokyo Big Sight (Tokyo International Exhibition Center) September 17 (Wed.) to 19 (Fri.), 2014. This new encoder enables precise angle detection in small spaces and is intended for use with precision measurement equipment and semiconductors.

*: This show features a wide range of exhibits of cutting-edge measurement devices used in all manner of industrial R&D, design, manufacturing, and quality control, among other areas.

Features of Exhibited Item

This encoder, to be exhibited for the first time, is the first encoder in an ultra-compact size (outer diameter of no more than 8 mm) that achieves a resolution of 36,000 pulses/revolution, which was made possible by the use of a new polarizing axis detection method. As a result, this encoder can be applied in small spaces, which was conventionally deemed difficult.

<Specific Uses>

  • Precision measuring instruments/optical devices
  • Semiconductor manufacturing equipment
  • Machine tools
  • Finger joints in industrial robots

Exhibit Information

Date September 17 (Wed.) to 19 (Fri.), 2014
Location Tokyo Big Sight (Ariake, Koto-ku, Tokyo)
Organizer Japan Measuring Instruments Federation (JMIF)
Booth No. M-71
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NSK is engaged in research into new technologies beyond the boundaries of its existing businesses, which include bearings, automotive parts, and precision machinery and parts. NSK is committed to continuing to meet broad industrial needs through world-leading technical capabilities that draw on its four core technologies of tribology, material engineering, analysis technology, and mechatronics.